HEAT INSULATION STRUCTURE AND ELECTRONIC APPARATUS

A heat insulation structure of one embodiment of the present disclosure includes: a heat source; a heat insulating member surrounding the heat source and having an opening; and a shape retaining member retaining a shape of the heat insulating member.

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Bibliographische Detailangaben
Hauptverfasser: MITSUI, TAKEO, ASASHIMA, SHIRO, SEKIYA, TOMOYUKI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A heat insulation structure of one embodiment of the present disclosure includes: a heat source; a heat insulating member surrounding the heat source and having an opening; and a shape retaining member retaining a shape of the heat insulating member.