HEAT INSULATION STRUCTURE AND ELECTRONIC APPARATUS
A heat insulation structure of one embodiment of the present disclosure includes: a heat source; a heat insulating member surrounding the heat source and having an opening; and a shape retaining member retaining a shape of the heat insulating member.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A heat insulation structure of one embodiment of the present disclosure includes: a heat source; a heat insulating member surrounding the heat source and having an opening; and a shape retaining member retaining a shape of the heat insulating member. |
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