INJECTION MOLDING APPARATUS WITH A THERMAL BRIDGE

An injection molding apparatus and hot runner system are disclosed. The injection molding apparatus includes a plurality of mold plates in which the hot runner system is received. A manifold receives molding material and has a manifold channel that extends between an inlet and an outlet. A nozzle de...

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Bibliographische Detailangaben
Hauptverfasser:	SAYER, Cheryl Ann, NGUYEN, Thanh Huu
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	An injection molding apparatus and hot runner system are disclosed. The injection molding apparatus includes a plurality of mold plates in which the hot runner system is received. A manifold receives molding material and has a manifold channel that extends between an inlet and an outlet. A nozzle delivers moldable material to a mold cavity. The nozzle has a nozzle channel in fluid communication between the manifold channel and the mold cavity. A valve pin seal is located at the upstream end of the nozzle, and a valve pin that is connected to an actuator extends through the manifold and nozzle is slidably received in the valve pin seal. The hot runner system further includes a thermal bridge that is in conductive thermal communication with the valve pin seal and a cooled one of the plurality of mold plates.