METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES DURING A NUMBER OF SEPARATING PROCESSES BY MEANS OF A WIRE SAW, AND SEMICONDUCTOR WAFER MADE OF MONOCRYSTALLINE SILICON

METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES DURING A NUMBER OF SEPARATING PROCESSES BY MEANS OF A WIRE SAW, AND SEMICONDUCTOR WAFER MADE OF MONOCRYSTALLINE SILICON

Wafer shape parameters from prior runs of simultaneously slicing a plurality of wafers from a workpiece in a wire saw having a sawing wire tensioned between wire guide rolls are used to alter the temperature profile of fixed and a moveable bearings at the ends of at least one wire guide roll, result...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WIESNER, Peter, PIETSCH, Georg
Format: Patent
Sprache:eng
Schlagworte:
PERFORMING OPERATIONS
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:Wafer shape parameters from prior runs of simultaneously slicing a plurality of wafers from a workpiece in a wire saw having a sawing wire tensioned between wire guide rolls are used to alter the temperature profile of fixed and a moveable bearings at the ends of at least one wire guide roll, resulting in wafers with low waviness.