SEMICONDUCTOR STACK AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR STACK AND METHOD FOR MANUFACTURING THE SAME

A semiconductor stack and a method for manufacturing the same are disclosed. The semiconductor stack includes a lower chip, an upper chip disposed over the lower chip, an upper lateral-side passivation layer surrounding side surfaces of the upper chip, and a plurality of bonding pads and a bonding p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHO, Hyoukyung, MOON, Kwangjin, LEE, Hakseung, JEON, Hyungjun
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor stack and a method for manufacturing the same are disclosed. The semiconductor stack includes a lower chip, an upper chip disposed over the lower chip, an upper lateral-side passivation layer surrounding side surfaces of the upper chip, and a plurality of bonding pads and a bonding passivation layer disposed between the upper chip and the lower chip.