SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR

A semiconductor module that can absorb thermal stress, and a manufacturing method therefor are provided. A semiconductor module includes a film interposer that includes a plurality of through electrodes which run in the thickness direction; a logic chip that is disposed on one surface side of the fi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MASUDA, Takatoshi, OKUTSU, Fumitake
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor module that can absorb thermal stress, and a manufacturing method therefor are provided. A semiconductor module includes a film interposer that includes a plurality of through electrodes which run in the thickness direction; a logic chip that is disposed on one surface side of the film interposer, and is connected electrically to the through electrodes; and a RAM unit that is a RAM module disposed on the other surface side of the film interposer, and connected electrically to the logic chip via the through electrodes.