SEMICONDUCTOR MODULE
A semiconductor module includes: semiconductor elements having a gate electrode, a first electrode and a second electrode; a resin mold; and conductive members connected to at least one of the semiconductor elements and having a common wiring electrode exposed from the resin mold and connected to th...
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creator | FUJITA, TOSHIHIRO SAITOU, ATSUSHI MIYACHI, SYUHEI NAGASE, NOBORU |
description | A semiconductor module includes: semiconductor elements having a gate electrode, a first electrode and a second electrode; a resin mold; and conductive members connected to at least one of the semiconductor elements and having a common wiring electrode exposed from the resin mold and connected to the first electrode or the second electrode and a non-common wiring electrode exposed from the resin mold and connected to an electrode of the semiconductor element different from the common wiring electrode. A width of a common wiring connected to the common wiring electrode is wider than the non-common wiring electrode. The common wiring is arranged from one side to an opposite side on a surface of the resin mold, on which the common wiring electrode is exposed, without being electrically connected to the non-common wiring electrode. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2022223501A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2022223501A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2022223501A13</originalsourceid><addsrcrecordid>eNrjZBAJdvX1dPb3cwl1DvEPUvD1dwn1ceVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRkBgbGpg6GhoTJwqAAKrH5o</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SEMICONDUCTOR MODULE</title><source>esp@cenet</source><creator>FUJITA, TOSHIHIRO ; SAITOU, ATSUSHI ; MIYACHI, SYUHEI ; NAGASE, NOBORU</creator><creatorcontrib>FUJITA, TOSHIHIRO ; SAITOU, ATSUSHI ; MIYACHI, SYUHEI ; NAGASE, NOBORU</creatorcontrib><description>A semiconductor module includes: semiconductor elements having a gate electrode, a first electrode and a second electrode; a resin mold; and conductive members connected to at least one of the semiconductor elements and having a common wiring electrode exposed from the resin mold and connected to the first electrode or the second electrode and a non-common wiring electrode exposed from the resin mold and connected to an electrode of the semiconductor element different from the common wiring electrode. A width of a common wiring connected to the common wiring electrode is wider than the non-common wiring electrode. The common wiring is arranged from one side to an opposite side on a surface of the resin mold, on which the common wiring electrode is exposed, without being electrically connected to the non-common wiring electrode.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS ; MOTOR VEHICLES ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; TRAILERS ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220714&DB=EPODOC&CC=US&NR=2022223501A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220714&DB=EPODOC&CC=US&NR=2022223501A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUJITA, TOSHIHIRO</creatorcontrib><creatorcontrib>SAITOU, ATSUSHI</creatorcontrib><creatorcontrib>MIYACHI, SYUHEI</creatorcontrib><creatorcontrib>NAGASE, NOBORU</creatorcontrib><title>SEMICONDUCTOR MODULE</title><description>A semiconductor module includes: semiconductor elements having a gate electrode, a first electrode and a second electrode; a resin mold; and conductive members connected to at least one of the semiconductor elements and having a common wiring electrode exposed from the resin mold and connected to the first electrode or the second electrode and a non-common wiring electrode exposed from the resin mold and connected to an electrode of the semiconductor element different from the common wiring electrode. A width of a common wiring connected to the common wiring electrode is wider than the non-common wiring electrode. The common wiring is arranged from one side to an opposite side on a surface of the resin mold, on which the common wiring electrode is exposed, without being electrically connected to the non-common wiring electrode.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS</subject><subject>MOTOR VEHICLES</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRAILERS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJdvX1dPb3cwl1DvEPUvD1dwn1ceVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRkBgbGpg6GhoTJwqAAKrH5o</recordid><startdate>20220714</startdate><enddate>20220714</enddate><creator>FUJITA, TOSHIHIRO</creator><creator>SAITOU, ATSUSHI</creator><creator>MIYACHI, SYUHEI</creator><creator>NAGASE, NOBORU</creator><scope>EVB</scope></search><sort><creationdate>20220714</creationdate><title>SEMICONDUCTOR MODULE</title><author>FUJITA, TOSHIHIRO ; SAITOU, ATSUSHI ; MIYACHI, SYUHEI ; NAGASE, NOBORU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022223501A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS</topic><topic>MOTOR VEHICLES</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRAILERS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>FUJITA, TOSHIHIRO</creatorcontrib><creatorcontrib>SAITOU, ATSUSHI</creatorcontrib><creatorcontrib>MIYACHI, SYUHEI</creatorcontrib><creatorcontrib>NAGASE, NOBORU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUJITA, TOSHIHIRO</au><au>SAITOU, ATSUSHI</au><au>MIYACHI, SYUHEI</au><au>NAGASE, NOBORU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR MODULE</title><date>2022-07-14</date><risdate>2022</risdate><abstract>A semiconductor module includes: semiconductor elements having a gate electrode, a first electrode and a second electrode; a resin mold; and conductive members connected to at least one of the semiconductor elements and having a common wiring electrode exposed from the resin mold and connected to the first electrode or the second electrode and a non-common wiring electrode exposed from the resin mold and connected to an electrode of the semiconductor element different from the common wiring electrode. A width of a common wiring connected to the common wiring electrode is wider than the non-common wiring electrode. The common wiring is arranged from one side to an opposite side on a surface of the resin mold, on which the common wiring electrode is exposed, without being electrically connected to the non-common wiring electrode.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS MOTOR VEHICLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRAILERS TRANSPORTING |
title | SEMICONDUCTOR MODULE |
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