SEMICONDUCTOR MODULE

A semiconductor module includes: semiconductor elements having a gate electrode, a first electrode and a second electrode; a resin mold; and conductive members connected to at least one of the semiconductor elements and having a common wiring electrode exposed from the resin mold and connected to th...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	FUJITA, TOSHIHIRO, SAITOU, ATSUSHI, MIYACHI, SYUHEI, NAGASE, NOBORU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS MOTOR VEHICLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRAILERS TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A semiconductor module includes: semiconductor elements having a gate electrode, a first electrode and a second electrode; a resin mold; and conductive members connected to at least one of the semiconductor elements and having a common wiring electrode exposed from the resin mold and connected to the first electrode or the second electrode and a non-common wiring electrode exposed from the resin mold and connected to an electrode of the semiconductor element different from the common wiring electrode. A width of a common wiring connected to the common wiring electrode is wider than the non-common wiring electrode. The common wiring is arranged from one side to an opposite side on a surface of the resin mold, on which the common wiring electrode is exposed, without being electrically connected to the non-common wiring electrode.