PROCESS FOR MAKING MULTILAYER STRUCTURE WITH BARRIER PROPERTIES

The invention relates to a method for producing a multilayer structure comprising an organic barrier layer, adhesive layer and substrate, comprising the following steps (a) providing a carrier film, (b) wherein a major part of the surface of the carrier film is provided with a release agent chosen f...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	JAHROMI, Shahab
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention relates to a method for producing a multilayer structure comprising an organic barrier layer, adhesive layer and substrate, comprising the following steps (a) providing a carrier film, (b) wherein a major part of the surface of the carrier film is provided with a release agent chosen from (i) an organic release layer, which organic release layer has the capacity to effect a releasable bond from the surface of the carrier film and a non-releasable bond with the surface of an organic barrier layer to be applied on the release layer and/or (ii) a metal layer on the carrier film which adheres stronger to the carrier film than to the organic barrier layer, (c) providing an organic barrier layer on the release agent, (d) providing an adhesive layer on the organic barrier layer, and bonding the organic barrier layer with said adhesive to a substrate, and (e) stripping said carrier film from the multilayer structure.