HEAT CONDUCTOR, HEAT-CONDUCTING MATERIAL, AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE

This application provides a heat conductor with a large coefficient of thermal conductivity, which can be used to dissipate heat for a semiconductor device, and in particular, may be used in the semiconductor device package field. The heat conductor includes a matrix, and a diamond particle and a fi...

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Bibliographische Detailangaben
Hauptverfasser:	XIAO, Kunhui, XIE, Ronghua, HE, Ran
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	This application provides a heat conductor with a large coefficient of thermal conductivity, which can be used to dissipate heat for a semiconductor device, and in particular, may be used in the semiconductor device package field. The heat conductor includes a matrix, and a diamond particle and a first metal nanoparticle that are distributed in the matrix, and an outer surface of the diamond particle successively includes a carbide film layer, a first metal film layer, and a second metal film layer. The three film layers are used to reduce interface thermal resistance between the diamond particle and the first metal nanoparticle. In addition, this application further provides a fluid heat-conducting material and a semiconductor package structure that uses the foregoing heat conductor.