Adhesive Composition

The present disclosure provides a composition. The composition contains (A) an ethylene/α-olefin copolymer containing (i) ethylene and (ii) from 20 wt % to 35 wt % C6-C8 α-olefin comonomer, the ethylene/α-olefin copolymer having a density from 0.880 g/cc to 0.895 g/cc, a melt viscosity, at 177° C.,...

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Bibliographische Detailangaben
Hauptverfasser:	Jin, Yi, McLennaghan, Allan Walter, Van Dun, Jozef J.I, Ma, Wanfu, Schneider, Ryan
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present disclosure provides a composition. The composition contains (A) an ethylene/α-olefin copolymer containing (i) ethylene and (ii) from 20 wt % to 35 wt % C6-C8 α-olefin comonomer, the ethylene/α-olefin copolymer having a density from 0.880 g/cc to 0.895 g/cc, a melt viscosity, at 177° C., from 4,000 mPa·s to 20,000 mPa·s, and a glass transition temperature from −55° C. to −20° C.; (B) a tackifier, and (C) a wax.