MICROCAPSULE
The present disclosure relates to electroless plating process for preparing microcapsules comprising an ionic shell encapsulating a fluid core. Platinum nanoparticles are used as the catalyst for the electroless plating process and are found in the fluid core. The ionic shell is comprised of inorgan...
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Format: | Patent |
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Zusammenfassung: | The present disclosure relates to electroless plating process for preparing microcapsules comprising an ionic shell encapsulating a fluid core. Platinum nanoparticles are used as the catalyst for the electroless plating process and are found in the fluid core. The ionic shell is comprised of inorganic salts, such as salts of alkaline earth metals. In particular electroless plating of calcium phosphate shell on to fluid cores, polymer encapsulated fluid cores and gel cores are disclosed. |
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