THERMOPLASTIC RESINS FOR NETWORK APPLICATIONS

The present disclosure relates to the use of thermoplastic resins in millimeter wave network applications. More specifically, it relates to polyamide materials meeting the requirements of dielectric performance in such applications.

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Bibliographische Detailangaben
Hauptverfasser:	Herzog, Benjamin D, Buzinkai, John F, Lim, Chee Sern, Shurish, James Michael, Iverson, Isaac K, Gulledge, Alexander L
Format:	Patent
Sprache:	eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present disclosure relates to the use of thermoplastic resins in millimeter wave network applications. More specifically, it relates to polyamide materials meeting the requirements of dielectric performance in such applications.