LIGHT EMITTING DIODE CHIP-SCALE PACKAGE AND METHOD FOR MANUFACTURING SAME

The present invention provides a LED chip scale package, comprising: a light emitting diode chip having a pad electrically connected to an external object on one side thereof, a phosphor silicon film surrounding the light emitting diode chip so that a bonding surface of the pad is exposed to an outs...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	PARK, Jae Suk, MIN, Jae Sik, LEE, Jae Yeop, CHO, Byoung Gu
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention provides a LED chip scale package, comprising: a light emitting diode chip having a pad electrically connected to an external object on one side thereof, a phosphor silicon film surrounding the light emitting diode chip so that a bonding surface of the pad is exposed to an outside, and a metal layer connected to the bonding surface and expanding a surface area of the pad, and a method for manufacturing the same.