Semiconductor Packages and Methods for Manufacturing Thereof

A package includes a dielectric carrier, an electronic component mounted on the dielectric carrier, and an encapsulant encapsulating at least part of the dielectric carrier and the electronic component. Corresponding methods of manufacturing the package are also described.

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Bibliographische Detailangaben
Hauptverfasser:	Cheong, Ying Dieh, Chiang, Chau Fatt, Saw, Khay Chwan Andrew, Tey, Sock Chien, Lopez, Fortunato, Wang, Mei Yong, Cha, Chan Lam, Lee, Swee Kah, Morban, Norliza, Danny Koh, Cher Hau, Loo, Desmond Jenn Yong, Yeo, Si Hao Vincent, Daryl Wee, Wern Ken
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A package includes a dielectric carrier, an electronic component mounted on the dielectric carrier, and an encapsulant encapsulating at least part of the dielectric carrier and the electronic component. Corresponding methods of manufacturing the package are also described.