ELECTROSTATIC CHUCK WITH SPATIALLY TUNABLE RF COUPLING TO A WAFER

A substrate support assembly to support a semiconductor substrate in a processing chamber includes a baseplate arranged in the processing chamber, a dielectric layer arranged on the baseplate to support the semiconductor substrate, an electrode disposed in the dielectric layer along a horizontal pla...

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Bibliographische Detailangaben
1. Verfasser: DREWERY, John
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A substrate support assembly to support a semiconductor substrate in a processing chamber includes a baseplate arranged in the processing chamber, a dielectric layer arranged on the baseplate to support the semiconductor substrate, an electrode disposed in the dielectric layer along a horizontal plane, and a plurality of channels to carry a fluid. The plurality of channels are disposed in the dielectric layer along the horizontal plane on a side of the electrode facing away from the baseplate.