PHOTORESIST UNDERLAYER COMPOSITIONS AND PATTERNING METHODS

A method of forming a pattern on a substrate, the method including:forming a photoresist underlayer over a surface of the substrate, wherein the photoresist underlayer is formed from a composition comprising a polymer and a solvent, and the photoresist underlayer has a carbon content of greater than...

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Bibliographische Detailangaben
Hauptverfasser: Kaitz, Joshua, Yamada, Shintaro, Finch, Michael, Coley, Suzanne M, LaBeaume, Paul J
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method of forming a pattern on a substrate, the method including:forming a photoresist underlayer over a surface of the substrate, wherein the photoresist underlayer is formed from a composition comprising a polymer and a solvent, and the photoresist underlayer has a carbon content of greater than 47 at %;subjecting the photoresist underlayer to a a metal precursor, where the metal precursor infiltrates a free volume of the photoresist underlayer; andexposing the metal precursor-treated photoresist underlayer to an oxidizing agent to provide a metallized photoresist underlayer.