ADAPTIVE SLURRY DISPENSE SYSTEM

Provided herein are advanced substrate polishing methods that use a machine-learning artificial intelligence (AI) algorithm, or a software application generated using the AI, to control one or more aspects of the polishing process. The AI algorithm is trained to simulate a polishing process and to m...

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Bibliographische Detailangaben
Hauptverfasser:	DESHPANDE, Sameer, HUEY, Sidney P, WITTY, Derek R
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS COMPUTING COUNTING DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING HANDLING RECORD CARRIERS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS PHYSICS POLISHING PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided herein are advanced substrate polishing methods that use a machine-learning artificial intelligence (AI) algorithm, or a software application generated using the AI, to control one or more aspects of the polishing process. The AI algorithm is trained to simulate a polishing process and to make predictions about the polishing process and process results expected therefrom, using substrate processing data acquired from a polishing system.