FARADAY ROTATOR INTERCONNECT AS A THROUGH-VIA CONFIGURATION IN A PATCH ARCHITECTURE

Embodiments disclosed herein include optical systems with Faraday rotators in order to enhance efficiency. In an embodiment, a photonics package comprises an interposer and a patch over the interposer. In an embodiment, the patch overhangs an edge of the interposer. In an embodiment, the photonics p...

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Hauptverfasser: BOYAPATI, Sri Ranga Sai, PRATAP, Divya, DESHPANDE, Nitin, KARHADE, Omkar, VADLAMANI, Sai, ECTON, Jeremy, TANAKA, Hiroki, LI, Xiaoqian, MAY, Robert Alan, PIETAMBARAM, Srinivas V, MARIN, Brandon C
Format: Patent
Sprache:eng
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Zusammenfassung:Embodiments disclosed herein include optical systems with Faraday rotators in order to enhance efficiency. In an embodiment, a photonics package comprises an interposer and a patch over the interposer. In an embodiment, the patch overhangs an edge of the interposer. In an embodiment, the photonics package further comprises a photonics die on the patch and a Faraday rotator passing through a thickness of the patch. In an embodiment, the Faraday rotator is below the photonics die.