SUBSTRATE TREATING APPARATUS AND FILLER MEMBER PROVIDED THEREIN

An apparatus for treating a substrate includes a vessel having a sealable process space formed therein in which the substrate is accommodated, a supply port that is provided inside a wall of the vessel and that supplies a process fluid into the process space, an exhaust port provided inside the wall...

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Bibliographische Detailangaben
Hauptverfasser: CHOI, Young Seop, PARK, Mi So, OH, Seung Hoon, WOO, Jong Hyeon, JAE, Jin Mo
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:An apparatus for treating a substrate includes a vessel having a sealable process space formed therein in which the substrate is accommodated, a supply port that is provided inside a wall of the vessel and that supplies a process fluid into the process space, an exhaust port provided inside the wall of the vessel and spaced apart from the supply port, and a buffer member provided in the process space, the buffer member being provided in a position overlapping with the supply port and the exhaust port when viewed from above. The buffer member includes a sidewall portion that is located outward of the supply port and the exhaust port and that makes contact with the wall of the vessel and an upper wall portion having a through-hole formed therein to correspond to a center of the substrate, the through-hole forming a straight flow path in an up/down direction.