TRANSPARENT ADHESIVE COMPOSITION, FILM-SHAPED TRANSPARENT ADHESIVE, METHOD OF PRODUCING TRANSPARENT ADHESIVE CURED LAYER-ATTACHED MEMBER, AND ELECTRONIC COMPONENT AND METHOD OF PRODUCING THE SAME

TRANSPARENT ADHESIVE COMPOSITION, FILM-SHAPED TRANSPARENT ADHESIVE, METHOD OF PRODUCING TRANSPARENT ADHESIVE CURED LAYER-ATTACHED MEMBER, AND ELECTRONIC COMPONENT AND METHOD OF PRODUCING THE SAME

A transparent adhesive composition including an epoxy resin (A), an epoxy resin-curing agent (B), and a phenoxy resin (C), wherein the epoxy resin-curing agent (B) satisfies the following (1) and (2):(1) the epoxy resin-curing agent (B) is in a powdery form and has a particle diameter (d90) at 90% c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WATAHIKI, Keita, SAKAI, Koyuki, MORITA, Minoru
Format: Patent
Sprache:eng
Schlagworte:
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:A transparent adhesive composition including an epoxy resin (A), an epoxy resin-curing agent (B), and a phenoxy resin (C), wherein the epoxy resin-curing agent (B) satisfies the following (1) and (2):(1) the epoxy resin-curing agent (B) is in a powdery form and has a particle diameter (d90) at 90% cumulative distribution frequency of 2.0 μm or less; and(2) the epoxy resin-curing agent (B) has solubility in 100 g of methyl ethyl ketone at 25° C. of 0.1 g or less;a film-shaped transparent adhesive processed therefrom;a method of producing a transparent adhesive cured layer-attached member by using the film-shaped transparent adhesive;a method of producing an electronic component; andan electronic component.