COMPONENT PLACEMENT SYSTEMS AND METHODS OF OPERATING THE SAME

COMPONENT PLACEMENT SYSTEMS AND METHODS OF OPERATING THE SAME

A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Brewel, Roy, Hoefs, Rudolphus Hendrikus, Van Sprang, Wilhelmus Gijsbertus Leonardus
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.