SEMICONDUCTOR DEVICE

A semiconductor device includes a semiconductor substrate, an insulating member provided on the semiconductor substrate and an electrode disposed on the semiconductor substrate and on the insulating member. The insulating member includes a plurality of first portions and a plurality of second portio...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Komatsu, Kanako
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A semiconductor device includes a semiconductor substrate, an insulating member provided on the semiconductor substrate and an electrode disposed on the semiconductor substrate and on the insulating member. The insulating member includes a plurality of first portions and a plurality of second portions thinner than the first portions. The first portions and the second portions are arranged alternately along a first direction, the first direction being parallel to a region of an upper surface of the semiconductor substrate not contacting the insulating member.