Chip Module, Use of Chip Module, Test Arrangement and Test Method

A chip module includes a chip having a front side and a rear side, a chip carrier having an upper side facing the chip, a contact layer formed of an electrically conductive material and arranged on the upper side of the chip carrier between the rear side of the chip and the upper side of the chip ca...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Pierschel, Michael, Findeisen, Christoph, Dobritz, Stephan
Format:	Patent
Sprache:	eng
Schlagworte:	ANALOGOUS ARRANGEMENTS USING OTHER WAVES BASIC ELECTRIC ELEMENTS DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS RADIO DIRECTION-FINDING RADIO NAVIGATION SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	A chip module includes a chip having a front side and a rear side, a chip carrier having an upper side facing the chip, a contact layer formed of an electrically conductive material and arranged on the upper side of the chip carrier between the rear side of the chip and the upper side of the chip carrier, and an electrically conductive adhesive arranged on an upper side of the contact layer facing the chip. The electrically conductive adhesive connects the upper side of the contact layer and the rear side of the chip. The contact layer has a plurality of regions electrically insulated from each other and each electrically connected to the chip by the electrically conductive adhesive.