PRINTED CIRCUIT BOARD

A printed circuit board includes a first substrate portion including a first insulating layer and a first wiring layer; and a second substrate portion disposed on the first substrate portion and including a second insulating layer, a pad disposed on the second insulating layer, and a first via penet...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MAENG, Duck Young, KIM, Sang Hoon, LEE, Yong Duk
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A printed circuit board includes a first substrate portion including a first insulating layer and a first wiring layer; and a second substrate portion disposed on the first substrate portion and including a second insulating layer, a pad disposed on the second insulating layer, and a first via penetrating through the second insulating layer and connecting the first wiring layer and the pad to each other. The first via has a boundary with each of the first wiring layer and the pad, and includes a first metal layer and a second metal layer disposed on different levels.