SYSTEMS AND METHODS FOR FOLDABLE MULTI-MODE BEND SENSORS

Disclosed embodiments include systems and methods for additively manufacturing (e.g., by "printing" or the like) a bend sensor as a 2D structure that can then be configured into a 3D or stacked structure. Further disclosed embodiments include bend sensors with foldable sensing regions conf...

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Bibliographische Detailangaben
Hauptverfasser:	Grimes, Nathan, Ottley, Colton A, Eichinger, Colin D, Jonas, Jared K, Briggs, Nathan C
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS TESTING
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Beschreibung
Zusammenfassung:	Disclosed embodiments include systems and methods for additively manufacturing (e.g., by "printing" or the like) a bend sensor as a 2D structure that can then be configured into a 3D or stacked structure. Further disclosed embodiments include bend sensors with foldable sensing regions configurable into a 3D or stacked structure. A differential strain in a sensing region is linearly proportional to the displacement as measured from the endpoints of the sensing region. The differential strain is measurable as a differential change in the capacitance of the sensing regions.