SINGULATING INDIVIDUAL CHIPS FROM WAFERS HAVING SMALL CHIPS AND SMALL SEPARATION CHANNELS

SINGULATING INDIVIDUAL CHIPS FROM WAFERS HAVING SMALL CHIPS AND SMALL SEPARATION CHANNELS

Embodiments of the invention include a method of singulating IC chips from a wafer. The method can include receiving the wafer having a substrate formed under active layers. The wafer includes a chip that includes a first portion of the active layers and a first portion of the substrate. A separatio...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Libsch, Frank Robert, Cabral, JR., Cyril, Subramanian, Chitra, Papalia, John M, Sorce, Peter Jerome, Lauro, Paul Alfred
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Embodiments of the invention include a method of singulating IC chips from a wafer. The method can include receiving the wafer having a substrate formed under active layers. The wafer includes a chip that includes a first portion of the active layers and a first portion of the substrate. A separation trench is formed by using an etch operation to remove a first segment of the active layers and a first segment of the substrate that are beneath a first separation channel of the wafer. The separation trench separates the first portion of the active layers from a remaining portion of the active layers; and separates the first portion of the substrate from a remaining portion of the substrate. The first IC chip is seperated from the wafer by removing a first section of the remaining portion of the substrate that is underneath the first portion of the substrate.