COOLING DEVICES FOR COOLING ELECTRONIC COMPONENTS WITH LIQUID COOLING COMPONENTS

COOLING DEVICES FOR COOLING ELECTRONIC COMPONENTS WITH LIQUID COOLING COMPONENTS

Cooling devices for cooling electronic components with liquid cooling and associated methods thereof are disclosed. According to an aspect, a device includes a housing that defines an interior space. The device also includes an electronic component positioned in the interior space. The device also i...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Kamath, Vinod, Artman, Paul, Junkins, Andrew
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:Cooling devices for cooling electronic components with liquid cooling and associated methods thereof are disclosed. According to an aspect, a device includes a housing that defines an interior space. The device also includes an electronic component positioned in the interior space. The device also includes a liquid cooling component configured to engage the housing and the electronic component for cooling the electronic component and the interior space.