CONDUCTIVE PVD STACK-UP DESIGN TO IMPROVE RELIABILITY OF DEPOSITED ELECTRODES

An electronic device can include a housing component that can define an interior surface and an exterior surface of the device, a metallic film deposited on the interior surface and extending at least partially onto the exterior surface, and a ceramic film deposited on the exterior surface and at le...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Melcher, Martin, Kim, Jungyup, Oetting, Wolf, Das, Anirban, Varadharajan, Srinivasan, Liang, Jiahui
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:An electronic device can include a housing component that can define an interior surface and an exterior surface of the device, a metallic film deposited on the interior surface and extending at least partially onto the exterior surface, and a ceramic film deposited on the exterior surface and at least partially over a portion of the metallic film on the exterior surface. The ceramic film can be in electrical communication with a portion of the metallic film deposited on the interior surface to form an electrical pathway from the exterior surface to the interior surface.