ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

An electronic device A1 of the present disclosure includes an electronic component 1, a support member (die pad portion 21 of a lead frame 2) including a mount surface (obverse surface 211) carrying the electronic component 1, and a bonding material 3 provided between the electronic component 1 and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	FUJI, Kazunori
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An electronic device A1 of the present disclosure includes an electronic component 1, a support member (die pad portion 21 of a lead frame 2) including a mount surface (obverse surface 211) carrying the electronic component 1, and a bonding material 3 provided between the electronic component 1 and the support member (die pad portion 21) for fixing the electronic component 1 to the support member (die pad portion 21). The mount surface (obverse surface 211) includes a first region 211a where a plurality of grooves 711 are formed and a second region 211b that surrounds the first region 211a as viewed in the z direction. The bonding material 3 is in contact with the first region 211a, and is not in contact with the second region 211b. This configuration serves to achieve an improvement in the reliability of the electronic device.