ISOLATION IN INTEGRATED CIRCUIT DEVICES

Disclosed herein are techniques for providing isolation in integrated circuit (IC) devices, as well as IC devices and computing systems that utilize such techniques. In some embodiments, a protective layer may be disposed on a structure in an IC device, prior to deposition of additional dielectric m...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Park, Sang-Won, Hanken, Dennis G, Bhowmick, Sishir, Pipes, Leonard C
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Disclosed herein are techniques for providing isolation in integrated circuit (IC) devices, as well as IC devices and computing systems that utilize such techniques. In some embodiments, a protective layer may be disposed on a structure in an IC device, prior to deposition of additional dielectric material, and the resulting assembly may be treated to form a dielectric layer around the structure.