SEMICONDUCTOR DEVICE AND METHOD MANUFACTURING THEREOF

The present disclosure relates to a semiconductor device and a method manufacturing thereof. The object of the present disclosure is to simplify manufacturing steps of a semiconductor device. A semiconductor device of the present disclosure includes an organic film electrically insulative and penetrated by a through hole in a thickness direction, a conductive layer formed on the organic film and made of a copper (Cu)-based and titanium (Ti)-free alloy, a Cu wiring layer formed on the conductive layer, a semiconductor element mounted on the Cu wiring layer, a sealing resin sealing the semiconductor element, and an external terminal connected to the conductive layer. The conductive layer includes the exposed conductive portion exposed from the organic film by entering the through hole. The external terminal is in contact with the exposed conductive portion.