SEMICONDUCTOR DEVICE, SOLID-STATE IMAGING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, SOLID-STATE IMAGING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

The present disclosure relates to a semiconductor device, a solid-state imaging device, and a method for manufacturing a semiconductor device capable of improving the voltage dependency of a gate capacitance type.Provided is a semiconductor device having a laminated structure in which a compound lay...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TOMITA, CHIHIRO, OKAMOTO, SHINTARO, HIRAI, TOMOHIRO
Format: Patent
Sprache:eng
Schlagworte:
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present disclosure relates to a semiconductor device, a solid-state imaging device, and a method for manufacturing a semiconductor device capable of improving the voltage dependency of a gate capacitance type.Provided is a semiconductor device having a laminated structure in which a compound layer formed on a surface of a semiconductor layer and formed by the semiconductor layer reacting with metal, an insulating film layer in contact with the compound layer, and an electrode layer formed on the insulating film layer are laminated. The present technology can be applied, for example, to an analog-to-digital (AD) conversion part included in the solid-state imaging device.