MODULE WITH IMPROVED THERMAL COOLING PERFORMANCE

An apparatus is described. The apparatus includes a semiconductor chip package having a semiconductor chip therein. The semiconductor chip package to communicate a temperature of the semiconductor chip. The apparatus includes a heat sink that is thermally coupled to the semiconductor chip package. T...

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Bibliographische Detailangaben
Hauptverfasser:	CHANNAIAH, Yogesh, WANG, Mirui, KHAN, Feroze, LARGE, Yvan, KALANTARIAN, Ali, LEE PACK, Jason, AMIRI, Shahin, GUTENBURG, Malcolm, LOW FOON, Tamara J, MAHARAJ, Saanjali, KONAKALLA, Srinivasarao, RANDELL, Andrew, TRIPLICANE GOPIKRISHNAN, Babu, SHAH, Tejas, K, Nagaraj
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	An apparatus is described. The apparatus includes a semiconductor chip package having a semiconductor chip therein. The semiconductor chip package to communicate a temperature of the semiconductor chip. The apparatus includes a heat sink that is thermally coupled to the semiconductor chip package. The heat sink has fins. The apparatus includes a fan. The apparatus includes a temperature sensing device. The temperature sensing device is to sense a temperature of an ambient before the ambient is warmed by the fins. A rotational speed of the fan is to be determined from the temperature of the semiconductor chip and the temperature of the ambient.