SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

In one example, an electronic device comprises a substrate comprising a first side and a second side, a first a lead on the second side, and a cavity in the second side adjacent to the first lead, an electronic component in the cavity and comprising a first terminal, a second terminal, and a third t...

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Bibliographische Detailangaben
Hauptverfasser: Jeon, Hyung II, Kim, Byong Jin, Bae, Jae Min, Kim, Gi Jeong, Lee, Seung Woo, Bowers, Shaun, Son, Yong Ho, Matsuda, Yoshio
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:In one example, an electronic device comprises a substrate comprising a first side and a second side, a first a lead on the second side, and a cavity in the second side adjacent to the first lead, an electronic component in the cavity and comprising a first terminal, a second terminal, and a third terminal, and a device encapsulant in the cavity and contacting a lateral side of the electronic component, and contacting a lateral side of the first lead opposite to the cavity. Other examples and related methods are also disclosed herein.