SHADOW RING KIT FOR PLASMA ETCH WAFER SINGULATION PROCESS

Shadow ring kits and methods of dicing semiconductor wafers are described. In an example, an etch apparatus includes a chamber, and a plasma source within or coupled to the chamber. An electrostatic chuck is within the chamber, the electrostatic chuck including a conductive pedestal to support a sub...

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Hauptverfasser: Thirunavukarasu, Sriskantharajah, Tatti, Arunkumar, Peh, Eng Sheng, Elumalai, Karthik, Sorensen, Michael
Format: Patent
Sprache:eng
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Zusammenfassung:Shadow ring kits and methods of dicing semiconductor wafers are described. In an example, an etch apparatus includes a chamber, and a plasma source within or coupled to the chamber. An electrostatic chuck is within the chamber, the electrostatic chuck including a conductive pedestal to support a substrate carrier sized to support a wafer having a first diameter. A shadow ring assembly is between the plasma source and the electrostatic chuck, the shadow ring assembly sized to process a wafer having a second diameter smaller than the first diameter.