DEEP MOLDED REFLECTOR CUP USED AS COMPLETE LED PACKAGE

A light emitting device is disclosed. The light emitting device comprises a metal lead frame including a first lead and a second lead. The light emitting device comprises a first bonding pad on the first lead. The light emitting device comprises a second bonding pad on the second lead. The light emi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	Butterworth, Mark Melvin
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A light emitting device is disclosed. The light emitting device comprises a metal lead frame including a first lead and a second lead. The light emitting device comprises a first bonding pad on the first lead. The light emitting device comprises a second bonding pad on the second lead. The light emitting device comprises a structure molded on the first lead and the second lead. The structure includes walls extending from a first area of the structure proximate to the metal lead frame. The light emitting device comprises a light emitting diode (LED) die disposed on the first area of the structure. The LED die includes a first electrode electrically coupled to the first bonding pad and a second electrode electrically coupled to the second bonding pad. The light emitting device comprises an encapsulant partially filling the structure.