DUMMY DIE IN A RECESSED MOLD STRUCTURE OF A PACKAGED INTEGRATED CIRCUIT DEVICE
Techniques and mechanisms for facilitating heat conductivity in a packaged device with a dummy die. In an embodiment, a packaged device comprises a substrate and one or more IC die coupled thereto. A dummy die structure extends to a bottom of a recess structure formed by a first package mold structu...
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| creator | Karhade, Omkar Modi, Mitul Van Nausdle, Joseph Cetegen, Edvin Raorane, Digvijay Haehn, Nicholas Agrawal, Vaibhav |
| description | Techniques and mechanisms for facilitating heat conductivity in a packaged device with a dummy die. In an embodiment, a packaged device comprises a substrate and one or more IC die coupled thereto. A dummy die structure extends to a bottom of a recess structure formed by a first package mold structure on the substrate. The dummy die structure comprises a polymer resin and a filler, or comprises a metal which has a low coefficient of thermal expansion (CTE). A second package mold structure, which extends to the recess structure, is adjacent to the first package mold structure and to an IC die. In another embodiment, a first CTE of the dummy die is less than a second CTE of one of the package mold structures, and a first thermal conductivity of the dummy die is greater than a second thermal conductivity of the one of the package mold structures. |
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In an embodiment, a packaged device comprises a substrate and one or more IC die coupled thereto. A dummy die structure extends to a bottom of a recess structure formed by a first package mold structure on the substrate. The dummy die structure comprises a polymer resin and a filler, or comprises a metal which has a low coefficient of thermal expansion (CTE). A second package mold structure, which extends to the recess structure, is adjacent to the first package mold structure and to an IC die. In another embodiment, a first CTE of the dummy die is less than a second CTE of one of the package mold structures, and a first thermal conductivity of the dummy die is greater than a second thermal conductivity of the one of the package mold structures.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220331&DB=EPODOC&CC=US&NR=2022102231A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220331&DB=EPODOC&CC=US&NR=2022102231A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Karhade, Omkar</creatorcontrib><creatorcontrib>Modi, Mitul</creatorcontrib><creatorcontrib>Van Nausdle, Joseph</creatorcontrib><creatorcontrib>Cetegen, Edvin</creatorcontrib><creatorcontrib>Raorane, Digvijay</creatorcontrib><creatorcontrib>Haehn, Nicholas</creatorcontrib><creatorcontrib>Agrawal, Vaibhav</creatorcontrib><title>DUMMY DIE IN A RECESSED MOLD STRUCTURE OF A PACKAGED INTEGRATED CIRCUIT DEVICE</title><description>Techniques and mechanisms for facilitating heat conductivity in a packaged device with a dummy die. In an embodiment, a packaged device comprises a substrate and one or more IC die coupled thereto. A dummy die structure extends to a bottom of a recess structure formed by a first package mold structure on the substrate. The dummy die structure comprises a polymer resin and a filler, or comprises a metal which has a low coefficient of thermal expansion (CTE). A second package mold structure, which extends to the recess structure, is adjacent to the first package mold structure and to an IC die. In another embodiment, a first CTE of the dummy die is less than a second CTE of one of the package mold structures, and a first thermal conductivity of the dummy die is greater than a second thermal conductivity of the one of the package mold structures.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNikEKwjAQRbNxIeodBlwLJj1BmEzroEklmRRclSJxJVqo98csPICLz3vw_loFl72_gWMCDmAhElJK5MD3FwdJYkbJkaBva7xaPNuuRg5CXbRSFTliZgFHAyNt1eoxPZey-3Gj9i0Jng5lfo9lmad7eZXPmJM5GqPrGm1189_rC3sXLrg</recordid><startdate>20220331</startdate><enddate>20220331</enddate><creator>Karhade, Omkar</creator><creator>Modi, Mitul</creator><creator>Van Nausdle, Joseph</creator><creator>Cetegen, Edvin</creator><creator>Raorane, Digvijay</creator><creator>Haehn, Nicholas</creator><creator>Agrawal, Vaibhav</creator><scope>EVB</scope></search><sort><creationdate>20220331</creationdate><title>DUMMY DIE IN A RECESSED MOLD STRUCTURE OF A PACKAGED INTEGRATED CIRCUIT DEVICE</title><author>Karhade, Omkar ; Modi, Mitul ; Van Nausdle, Joseph ; Cetegen, Edvin ; Raorane, Digvijay ; Haehn, Nicholas ; Agrawal, Vaibhav</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022102231A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Karhade, Omkar</creatorcontrib><creatorcontrib>Modi, Mitul</creatorcontrib><creatorcontrib>Van Nausdle, Joseph</creatorcontrib><creatorcontrib>Cetegen, Edvin</creatorcontrib><creatorcontrib>Raorane, Digvijay</creatorcontrib><creatorcontrib>Haehn, Nicholas</creatorcontrib><creatorcontrib>Agrawal, Vaibhav</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Karhade, Omkar</au><au>Modi, Mitul</au><au>Van Nausdle, Joseph</au><au>Cetegen, Edvin</au><au>Raorane, Digvijay</au><au>Haehn, Nicholas</au><au>Agrawal, Vaibhav</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DUMMY DIE IN A RECESSED MOLD STRUCTURE OF A PACKAGED INTEGRATED CIRCUIT DEVICE</title><date>2022-03-31</date><risdate>2022</risdate><abstract>Techniques and mechanisms for facilitating heat conductivity in a packaged device with a dummy die. In an embodiment, a packaged device comprises a substrate and one or more IC die coupled thereto. A dummy die structure extends to a bottom of a recess structure formed by a first package mold structure on the substrate. The dummy die structure comprises a polymer resin and a filler, or comprises a metal which has a low coefficient of thermal expansion (CTE). A second package mold structure, which extends to the recess structure, is adjacent to the first package mold structure and to an IC die. In another embodiment, a first CTE of the dummy die is less than a second CTE of one of the package mold structures, and a first thermal conductivity of the dummy die is greater than a second thermal conductivity of the one of the package mold structures.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | DUMMY DIE IN A RECESSED MOLD STRUCTURE OF A PACKAGED INTEGRATED CIRCUIT DEVICE |
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