DUMMY DIE IN A RECESSED MOLD STRUCTURE OF A PACKAGED INTEGRATED CIRCUIT DEVICE

Techniques and mechanisms for facilitating heat conductivity in a packaged device with a dummy die. In an embodiment, a packaged device comprises a substrate and one or more IC die coupled thereto. A dummy die structure extends to a bottom of a recess structure formed by a first package mold structu...

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Bibliographische Detailangaben
Hauptverfasser: Karhade, Omkar, Modi, Mitul, Van Nausdle, Joseph, Cetegen, Edvin, Raorane, Digvijay, Haehn, Nicholas, Agrawal, Vaibhav
Format: Patent
Sprache:eng
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Zusammenfassung:Techniques and mechanisms for facilitating heat conductivity in a packaged device with a dummy die. In an embodiment, a packaged device comprises a substrate and one or more IC die coupled thereto. A dummy die structure extends to a bottom of a recess structure formed by a first package mold structure on the substrate. The dummy die structure comprises a polymer resin and a filler, or comprises a metal which has a low coefficient of thermal expansion (CTE). A second package mold structure, which extends to the recess structure, is adjacent to the first package mold structure and to an IC die. In another embodiment, a first CTE of the dummy die is less than a second CTE of one of the package mold structures, and a first thermal conductivity of the dummy die is greater than a second thermal conductivity of the one of the package mold structures.