IMAGING DEVICE AND ELECTRONIC APPARATUS

An imaging device according to the present disclosure has a stacked chip structure in which at least two semiconductor chips, that are a first semiconductor chip provided with a pixel circuit and a second semiconductor chip including an analog-to-digital (AD) conversion circuit which is provided so as to correspond to the pixel circuit, are stacked. The AD conversion circuit includes a latch circuit that retains a digital code after AD conversion and a transfer circuit that transfers the digital code after AD conversion. Further, a failure detection circuit for detecting a failure of the AD conversion circuit is provided. The failure detection circuit performs failure detection by writing a test pattern for failure detection into the latch circuit via the transfer circuit, then reading the test pattern from the latch circuit via the transfer circuit, and comparing the read test pattern with an expected value.