MAGNETIC CORE INDUCTORS IN INTERPOSER

Embodiments disclosed herein include coreless interposers with embedded inductors. In an embodiment, a coreless interposer comprises a plurality of buildup layers, where electrical routing is provided in the plurality of buildup layers. In an embodiment, the coreless interposer further comprises an...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LAMBERT, William J, AUGUSTINE, Anne, KULASEKARAN, Siddharth, HARIRI, Haifa, BHARATH, Krishna, MANUSHAROW, Mathew
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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