MAGNETIC CORE INDUCTORS IN INTERPOSER

Embodiments disclosed herein include coreless interposers with embedded inductors. In an embodiment, a coreless interposer comprises a plurality of buildup layers, where electrical routing is provided in the plurality of buildup layers. In an embodiment, the coreless interposer further comprises an...

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Bibliographische Detailangaben
Hauptverfasser: LAMBERT, William J, AUGUSTINE, Anne, KULASEKARAN, Siddharth, HARIRI, Haifa, BHARATH, Krishna, MANUSHAROW, Mathew
Format: Patent
Sprache:eng
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Zusammenfassung:Embodiments disclosed herein include coreless interposers with embedded inductors. In an embodiment, a coreless interposer comprises a plurality of buildup layers, where electrical routing is provided in the plurality of buildup layers. In an embodiment, the coreless interposer further comprises an inductor embedded in the plurality of buildup layers. In an embodiment, the inductor comprises a magnetic shell, and a conductive lining over an interior surface of the magnetic shell.