VIA CONNECTIONS FOR STAGGERED INTERCONNECT LINES

VIA CONNECTIONS FOR STAGGERED INTERCONNECT LINES

Via connections for staggered interconnect lines are disclosed. An interconnect structure includes a first plurality of interconnects and a second plurality of interconnects, wherein the first plurality of interconnects and the second plurality of interconnects are staggered such that individual int...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: JEZEWSKI, Christopher J, LIN, Kevin Lai
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Via connections for staggered interconnect lines are disclosed. An interconnect structure includes a first plurality of interconnects and a second plurality of interconnects, wherein the first plurality of interconnects and the second plurality of interconnects are staggered such that individual interconnects of the second plurality of interconnects are laterally offset from individual interconnects of the first plurality of interconnects. The interconnect structure also includes a via coupling an individual interconnect of the first plurality of interconnects to an individual interconnect of the second plurality of interconnects.