INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the s...

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Hauptverfasser:	PARK, Changyoung, LEE, Yoonsoo, LEE, Byoungok, IM, Seungwon, JEON, Oseob, LEE, Dukyong, SON, Joonseo
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	PARK, Changyoung LEE, Yoonsoo LEE, Byoungok IM, Seungwon JEON, Oseob LEE, Dukyong SON, Joonseo
description	Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
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