INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the s...

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Bibliographische Detailangaben
Hauptverfasser: PARK, Changyoung, LEE, Yoonsoo, LEE, Byoungok, IM, Seungwon, JEON, Oseob, LEE, Dukyong, SON, Joonseo
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.