SEMICONDUCTOR PACKAGE WITH DAMS

A semiconductor package and a method of manufacturing thereof is disclosed. The package includes a package substrate having a die attach region with a die attached thereto. A protective cover is disposed over a sensor region of the die and attached to the die by a cover adhesive. The package include...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Punzalan, Jeffrey, SHIM, IL KWON
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A semiconductor package and a method of manufacturing thereof is disclosed. The package includes a package substrate having a die attach region with a die attached thereto. A protective cover is disposed over a sensor region of the die and attached to the die by a cover adhesive. The package includes a dam structure configured to protect components of the semiconductor package from contamination.