Alternating Current (AC) Dual Magnetron Sputtering

Alternating Current (AC) Dual Magnetron Sputtering

Power systems, sputtering systems, and sputtering methods are disclosed. A sputtering system comprises at least one electrode pair comprising a first electrode and a second electrode, and each electrode of the dual electrode pair is configured to support target material. The sputtering system also i...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Romanus, Paul, Pelleymounter, Douglas R, Lacy, Matthew James
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
RESONATORS
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:Power systems, sputtering systems, and sputtering methods are disclosed. A sputtering system comprises at least one electrode pair comprising a first electrode and a second electrode, and each electrode of the dual electrode pair is configured to support target material. The sputtering system also includes a generator configured to provide an alternating voltage waveform and at least one balun comprising a balanced side coupled to the first electrode and the second electrode and an unbalanced side coupled to the generator. The sputtering system also includes means for inductively coupling power, applied from the generator, from the unbalanced side to the balanced side.