SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING OF A SEMICONDUCTOR PACKAGE

A semiconductor package including a lead frame, an Ag plated surface positioned on the lead frame, an adhesion promotion layer positioned on the top of the Ag plated surface, and mold body covering the top of the lead frame is provided. The Ag plated surface covers a significant part of an interconn...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HO, Wai Keung, WONG, Raymond, CHAU, On Lok, NG, Kim
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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