SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING OF A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING OF A SEMICONDUCTOR PACKAGE

A semiconductor package including a lead frame, an Ag plated surface positioned on the lead frame, an adhesion promotion layer positioned on the top of the Ag plated surface, and mold body covering the top of the lead frame is provided. The Ag plated surface covers a significant part of an interconn...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HO, Wai Keung, WONG, Raymond, CHAU, On Lok, NG, Kim
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package including a lead frame, an Ag plated surface positioned on the lead frame, an adhesion promotion layer positioned on the top of the Ag plated surface, and mold body covering the top of the lead frame is provided. The Ag plated surface covers a significant part of an interconnection area of the lead frame surface, and the Ag plating surface does not exceed the area of the mold body.