EMBEDDED COOLING CHANNEL IN MAGNETICS

Embodiments disclosed herein include electronic packages and methods of forming electronic packages. In an embodiment, an electronic package comprises, a package substrate, and a magnetic block, where the magnetic block passes through the package substrate. In an embodiment, the electronic package further comprises a fluidic path from an inlet to the package substrate to an outlet of the package substrate. In an embodiment, the electronic package further comprises a conductive winding in the package substrate, where the conductive winding wraps around the magnetic block, and where the conductive winding is tubular and the fluidic path passes through the conductive winding.