SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

In one embodiment, a semiconductor device includes a substrate, and a plurality of electrode layers provided separately from each other in a first direction perpendicular to a surface of the substrate. The device further includes a first insulator, a charge storage layer, a second insulator, a first...

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Bibliographische Detailangaben
Hauptverfasser: OKUCHI, Hisashi, SAWA, Keiichi, IMAMURA, Tsubasa, YAMASHITA, Hiroyuki, MORITA, Takaumi, YANASE, Toshiaki
Format: Patent
Sprache:eng
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Zusammenfassung:In one embodiment, a semiconductor device includes a substrate, and a plurality of electrode layers provided separately from each other in a first direction perpendicular to a surface of the substrate. The device further includes a first insulator, a charge storage layer, a second insulator, a first semiconductor region including silicon, and a second semiconductor region including silicon and carbon, which are provided in order on side faces of the electrode layers, wherein an interface between the first semiconductor region and the second insulator includes fluorine.